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For the small-pitch LED screen of COB technology, there are many misunderstandings on the market. On the one hand, many people think that this is an expensive technology; on the other hand, many people think that surface-mount technology is enough, and new technology may not have much future. However, since 2016, the development of COB small spacing, especially in the high-end market, has shown that a recent news that Dehao Runda led the market to develop a fully flip-chip RGB COB display module has become the focus of the industry. This is the second time after the release of the third-generation COB display technology by Lehman shares on the 7th of this month, the COB display once again successfully caught people's attention. Less than a month before and after, LED listed companies have repeatedly revealed the latest information on the COB display, which is rare. This is like letting the COB display, which has always been very low in existence, be placed under the spotlight and become a target. For the small-pitch LED screen of COB technology, there are many misunderstandings on the market. On the one hand, many people think that this is an expensive technology; on the other hand, many people think that surface-mount technology is enough, and new technology may not have much future. However, since 2016, the development of COB small spacing, especially in the high-end market, has shown that there is no limit to technological innovation! With the market reality, why is COB popular in the domestic high-end large-screen engineering market leader, Weichuang It said that since the introduction of COB small-pitch LED screens to the market in the second half of 2016, it has received orders from more than 100 high-end command and dispatch centers. The small spacing of the COB is responsible for most of the growth of the large screen. Domestic LED packaging and testing enterprises have entered a large-scale expansion cycle since the second half of 2015. A considerable part of the new capacity is arranged in the COB packaging technology. This is not only because of the accelerated development of COB LED display applications, including lighting applications, backlighting applications for mobile phones and televisions, but also into the era of COB chip-level packaging. At the level of basic LED wafer manufacturers, the development of small-particle high-brightness crystals is also becoming more and more abundant. Taiwanese companies pay special attention to the market potential of the latter, and believe that MIN-LED technology will be one of the main directions of the short-term LED application incremental market. It can be said that the rise of COB technology is not a single person's single fight, but the resonance of the entire industry chain. From upstream wafers, packaging to downstream applications, and equipment and materials manufacturers, they are supporting the development of COB products. The comprehensive optimism of the industrial chain will inevitably mean that COB technology has its own unique advantages. These advantages are also the key to the large-screen market and the rapid landing of COB products. First of all, the large screen of COB technology is better in stability. On the one hand, the COB technology is a chip-scale package, and the LED crystal particles directly contact the PCB board (whether in formal or flip-chip), which increases the available heat conduction area of ​​the LED crystal and improves the heat dissipation capability. At the same time, this chip-level packaging method is completely covered, that is, the LED crystal is put on a layer of 100% protective armor, which is good for moisture and bump prevention. On the other hand, COB packaging technology does not require a reflow process for surface-mount LED display products. The reflow process is a higher temperature soldering process. LED crystals are temperature sensitive. The reflow process is actually the biggest factor in the LED lamp product dead light and lamp life reduction. COB is precisely because the reflow process is not required, so its dead light rate is only one tenth of the surface mount process, and the stability is greatly improved. For LED large-screen applications, especially the command and dispatch center, stability and reliability are the core requirements. Wistron believes that this is the point that COB technology has absolute right to speak in the high-end small-pitch LED application market. Second, for audiovisual engineering, the visual experience is also an important choice. The COB small pitch technology features chip-scale packaging and full coverage of optical resins. Compared with the traditional surface-mounted lamp beads, this structure has great differences in image quality. The high brightness of the LED screen is an advantage, but it is also a disadvantage of indoor applications. High-brightness glare, high-frequency refreshing vertigo, and the graininess of the lamp bead surface make the LED screen face the high-end command and dispatch center, which is close to the application time and long viewing time, which is especially easy for visual fatigue. The latter is a drawback that many customers cannot accept. The COB small pitch technology can well eliminate the visual experience disadvantage of these traditional LED screens. The COB package achieves better video optical performance through chip-level packaging. The picture quality is more comfortable and soft, and there is no significant pixel graininess. It is more suitable for closer distance, indoor ambient light, longer time and long-term viewing. Applications. For this advantage, Wistron will fall in love with COB to describe it, which fully demonstrates the market experience advantage of COB products. Higher stability, reliability, better look and feel is a realistic support point for COB small pitch to become the next generation product standard. However, this is not the full advantage of COB technology. Looking forward to the future, COB leads a new breakthrough in small-pitch LEDs Since the birth of the small-pitch LED screen, it has been continuously compressing its own point-to-point indicators. At present, there are already manufacturers in the country to introduce 0.7 and 0.8 mm pitch products. However, this product has not been mass-produced and applied on a large scale, and has encountered limits and ceilings in marketization. The further technological development of small-pitch LEDs must rely on the advancement and innovation of basic processes. COB technology is this new and advanced technology. First of all, COB small-pitch LED technology is beneficial to the control of the dead-point rate under extremely small pitch and a large number of lamp bead conditions. With less than one-tenth of the SMD surface-mounting process, the product achieves higher reliability and realizes market-oriented application of high pixel density products. COB technology is at the forefront. Second, the COB technology using the chip-scale packaging process essentially replaces the two-step process of surface-mounting after the surface-mounting process is first packaged. As a more simplified engineering method, its cost change is more controllable at the same application scale, especially in the face of smaller and smaller pixels. That is to say, if the PMD surface sticker can be said to be able to speak on the price advantage of the P1.5 pitch product, then the cost advantage of the SMD surface sticker compared with the COB will be reversed in the product of P1.0 and below. This is the simplification of the entire engineering process, as well as the advantages of direct-scale packaging of LED crystals at the chip level. Third, as the future development direction of the LED display industry, smaller crystal particles on small-pitch products are promising. Advances in LED lighting technology are sufficient for smaller LED crystal particles to have sufficient brightness, lower heat generation, and the need to display large screens. Instead of integrating smaller LED crystal particles, it is clear that COB packaging technology is more suitable than the traditional engineering route of the first lamp post. As the manufacturer of LED display technology, when developing the technical route, the future development space is a very important factor. The LED display screen develops to a smaller pitch, the SMD technology encounters a bottleneck, and the COB technology realizes the LED display small/micro The advantage in spacing is obvious, Wistron thinks so. In 2017, Samsung strengthened the promotion of small-pitch LED screens in the digital cinema projection market, and Sony increased the promotion of small-pitch LED screens in the production-level film and television market. The two giants are all supporters of package-level technology such as COB. From a product development perspective, Sony has demonstrated LED-screen products based on MINI-LED particles in chip-scale packages with a pitch of only 0.5 mm. The LED upstream industry in Taiwan, China, believes that the screen application of MINI-LED products will start in 2018, including small-pitch LED screens and direct-lit LCD backlight products will enter an accelerated development stage. In September 2017, the news came from the Ministry of Science and Technology: COB, as the development direction of the future small-pitch LED, was funded by the National Leading Scientific Research Project for the 13th Five-Year Key Scientific Research Project. The main task is to break through the traditional small-pitch LED display. Technical deficiencies and limitations. With its significant advantages, COB has won the choice of international manufacturers, upstream recognition in the industry and government support, making COB technology a key development direction for future small-pitch LED products. This is why the industry calls COB the core of the second generation of small-pitch LED screens. Of course, even if it is a very good technology, COB small spacing can not occupy the entire market as soon as it comes up, starting from the high-end, and gradually popularizing. This process has also been the past six years of pasting small-space LED large-screen products. the way. However, it is now the turn of COB small-pitch products to re-interpret the market iterative process of popularizing high-end and popularization.
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