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Nikkei BP reported on July 21, 2005 that Meiji Electric (headquarters: Nagoya City) has introduced a cleaning device "MPC-250" for removing dust attached to printed circuit boards. If dust is stuck on the board, the solder sometimes breaks due to vibration. Since the cleaning device can remove dust of 5 μm or more, it is possible to prevent malfunction caused by cracking of the solder. The price is 1.98 million yen (about RMB 152,000. Excluding tax).
Remove dust by using three bonding rollers sandwiched on the lower side of the board. The bonding roller to which dust adheres is cleaned by contact with each of the two transfer rollers disposed at the upper or lower portion (outer side) thereof. It is only necessary to clean the rollers regularly to ensure the dust removal performance. Miniaturization and low price through thin provisioning.
As an option, you can also choose a conveyor that passes directly through the production line without board removal. For a production line that is to be packaged on both sides of the board, the roller unit can be replaced with such a conveyor.
Remove dust by using three bonding rollers sandwiched on the lower side of the board. The bonding roller to which dust adheres is cleaned by contact with each of the two transfer rollers disposed at the upper or lower portion (outer side) thereof. It is only necessary to clean the rollers regularly to ensure the dust removal performance. Miniaturization and low price through thin provisioning.
As an option, you can also choose a conveyor that passes directly through the production line without board removal. For a production line that is to be packaged on both sides of the board, the roller unit can be replaced with such a conveyor.
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