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Panasonic recently announced that it has developed a blue-violet semiconductor laser that operates at 4.5 watts and delivers 1.5 times the output power of traditional lasers even at its maximum laser operating temperature (60 ° C). The laser can also achieve high energy conversion efficiency of laser resonance, the conversion efficiency of 1.2 times the traditional laser. Matsushita's unique double-sided heat-flow packaging technology makes it possible to improve heat dissipation. This newly developed laser will help make laser applications more compact and consume less power, such as automotive and industrial lighting and laser processing equipment.
In general, the output power of a semiconductor laser decreases as the temperature of the laser chip increases. In addition, the actual light output that can be used for practical applications is limited by the laser chip temperature, since temperature is a determinant of the laser's reliability (this is because the functional reliability of the laser depends on the laser chip temperature). Conventional blue-violet lasers heat only from one side of the laser chip, causing the laser chip temperature to rise and limit the power output to about 3 watts. Laser systems that require tens of watts of power output will require a large number of lasers, resulting in more heat generation and larger heat sinks. In order to solve this problem, a single laser needs higher efficiency and larger output.
The newly developed double-sided heat-flow packaging technology can suppress the laser chip temperature rise, thus ensuring the laser beam output. As a result, it is also possible to avoid the drop of the laser beam output due to the heat generation, and to achieve high output and high efficiency operation. Therefore, in a laser system using multiple lasers, the number of lasers can be reduced to two-thirds that of a conventional laser. In addition, the system itself can be smaller and lighter because its size can be reduced.
The newly developed laser has the following features:
High output:
The maximum light output power of 4.5 watts (1.5 times the existing product * 2)
High power conversion efficiency:
33% (1.2 times of existing product * 3)
High reliability:
Blue violet semiconductor laser chip strain reduction, to achieve a stable output
The device can be implemented with the following technologies:
By forming a heat flow path on both sides of the laser chip to achieve an excellent heat dissipation structure, the thermal conductivity of the laser chip is improved to 1.6 times that of the existing product (thermal resistance: new product 6.6K / W, existing product 10.5K / W)
The low-strain heat-slug construction uses aluminum nitride, which has almost the same thermal expansion coefficient as the laser chip
Based on the new high-output blue-violet semiconductor laser technology, Matsushita owns 23 patents in Japan and 31 patents overseas, including some pending patent applications.
Matsushita presented its research results at the 2015 International Conference on Solid-State Devices and Materials held in Sapporo, Japan on September 28th.
This work was partially supported by Japan's New Energy and Industrial Technology Development Organization (NEDO) and included in the Energy Conservation Technology Strategy Innovation Program.
* In 60 ℃ continuous wave working condition, in actual operation
* Compared with the traditional structure of the laser developed by Panasonic (at 60oC operating temperature)
* At 60 ℃ operating temperature, the light output is 3 watts
Process
The sheet is processed in the following steps: decoil the raw material, feed with a fixed length via the servo motor, shearing it with various shearing tools into sheets of various types according to the drawing and then piling them on the stacking table via the conveying mechanism and the arranging mechanism.
Functional features:
1. This device can complete automatic production of various sheets for laminated, Full tapered seam cores.
2. Shearing power: imported electrical servo control technology is adopted, so the device is featured by high speed, low noise and long life.
3. Feeding power: adopt high torque AC synchronous servo motor, so has characteristics such as rapid response, high positioning and accuracy, low noise, low braking thermal loss and long life.
4. Track positioning: the centralized positioning is achieved by dragging the linear tracks of the ball screw with a servo motor. So the positioning is rapid, accurate and convenient and the track width can be memorized automatically.
5. Movement control: advanced PCC control and ethernet powerlink communication technology is adopted, reducing greatly wiring and imporving the reliability, stability and real time of the system remote control and trouble diagnosis can be achieved via the above control and technology, shortening the maintenance time and reducing the cost to the largest extent.
6. Arrangement mode: the backward pushing arrangement mde is adopted and long sheets can be arranged orderly with low vibration, reducing the orientational permeance of the processing process on silicon steel sheets to the largest extent.
7. Life guarantee: standard components of the device are imported quality ones. High accuracy of processing and assembly of basic components extents the service life of the device to the largest extent.
8. This device is a high techmechanical, optical and electrical integrated product with multiple patented technologies, it represents high manufacture level of domestic transverse shear lines and can substitute imported products, saving much outsourcing fund. Some models have automatic cut in cut become column functions.
Cut To Length Machine,Cut To Length Line Machine,Cut To Length Line,Metal Shearing Machine
JINAN EURO-ASIA MACHINERY CO., LTD , https://www.sdwindingmachine.com